Top electrical parts info aggregation platform? When the user equipment communicates with the AP1, because the equipment receives the interference signal of the AP2 with the same frequency, the user equipment will mistakenly think that the cell of the AP1 is being occupied by other devices in the cell at this time, so wait for the next time period to send. As a result, network performance is degraded. Not only multi-cell networking, this kind of interference problem will also occur when the Wi-Fi AP is very close. For example, although you have only one wireless AP in your home, if your next-door neighbor has an AP deployed on the same channel as you, CCI will also reduce the success rate of your device access. Sadly, most manufacturers put Wi-Fi AP’s default channel on the first channel when the device leaves the factory. In this way, the problem of interference is even more serious. If you find this problem, you might as well change the Wi-Fi AP channel at home, which will significantly reduce interference and increase Internet speed. The solution of Wi-Fi 6 is to distinguish the local cell from the interference cell by introducing BSS Coloring (Cell Color coding) technology into the MAC layer. In other words, when working on the same channel, the AP that interferes with each other will be distinguished by different color codes. Find extra info on rbr2mm60btftr.
Then, as demand for cars picks up in the fall of 2020, Toyota Denso Renesa plans to order 28nm semiconductors from TSMC again, but there is no room to produce in-car semiconductors because TSMC lines are occupied by other semiconductors. Although the inventory in the autumn and winter of 2020 exceeded the limit, by 2021, inventory had bottomed out, coupled with the shortage of 28nm semiconductors, cars could not be made. 28nm is the last generation of planar transistors (FinFET from 16 / 14nm to 3D) (2) do not use self-aligned double pattern (SADP) (will use SADP from FinFET) (3) Renesas vertical integration (integrated equipment manufacturer IDM), for example, outsource production to FinFET from this generation. In short, 28nm semiconductors produced by TSMC and other contract factories have a good performance-to-price ratio, so many electronic devices, including automobiles, use this semiconductor. At the invitation of the Japanese government, the TSMC Kumamoto plant, which will begin operation in 2024, will also mainly produce such 28nm semiconductors.
The integration density of the current CPU is very high. The above functions are now integrated into the CPU and become a chip. For example, the K60 chip I am using now has these peripheral functions. The four chips of the early CPU peripherals are now integrated into one chip, so the current System is in one chip. That is, System on Chip (SoC), so theoretically there is a difference between CPU and SoC. The standard CPU refers to the early chips that only contain arithmetic units and controllers, and SoC has integrated the system into a whole chip. Therefore, the chips you buy now are all SoCs, and the standard CPUs are not too big to buy. Today’s CPUs have integrated many peripherals inside.
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